Electroplating copper interconnects

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Transcript of Electroplating copper interconnects

A B R A S I V E ARTICLE U.S. Patent 6,245,406. June 12, 2001 H. Kuramochi and Y. Kubota, assignors to Tosoh Corp., Yamaguchi, Japan

An abrasive polishing disk com- pr i s ing at l eas t one ab ras ive shaped polishing article and a supporting auxiliary; said shaped polishing article being a molded article made by molding a silica powder and fitted to the support- ing auxiliary, and comprising at least 90% by weight.

ELECTROPLATING COPPER INTERCONNECTS U.S. Patent 6,245,676. June 12, 2001 K. Ueno, assignor to NEC Corp., Tokyo, Japan

In a method of manufacturing a semiconductor device comprising the steps of providing a trench along a wiring scheduled portion of an insulating film formed on a substrate; forming a metal seed layer on the insulating film in- cluding the trench; forming a de- posit layer of a metal wiring ma-

terial on the metal seed layer to completely bury the trench with the aid of an electrical plating method where the meta l seed layer is used as one electrode; and polishing and removing the de- posit layer of the metal wiring material until the insulating film is again exposed, to form a buried wiring in the trench, the improve- ment being wherein the method further comprises upon forming the buried wiring protruding the deposit layer of the metal wiring material on said trench and one a peripheral area by controlling a current of the electrical plating method; and polishing and remov- ing the deposit layer until the in- sulating film is exposed.

S P R A Y B Q O T H WALL U.S. Patent 6,247,290. June 19, 2001 W. Kimmerle and R. Bnzinge, assignors to Eisenmann Maschinenbau KG, Germany

A wall for the booth of a coating plant comprising a frame consist-

ing of at least two hollow vertical posts and at least two hollow hor- izontal crosspieces; at least one pla te , which covers a zone spanned by the posts and the crosspieces; a securing device for each plate by means of which the plate is secured in a removable manner to the posts and cross- pieces bounding the correspond- ing zone, characterized in that the securing device consists of a plu- rality of spaced blocking devices, which each have at least one re- taining portion and one contact portion.

SEALING A N O D I Z E D A L U M I N U M U.S. Patent 6,248,184. June 19, 2001 D.L. Dull and F.B. Mansfeld, assignors to The Boeing Co., Seattle, Wash., and University of Southern California, Los Angeles, Calif.

A chemical solution for sealing the surface coating formed by an- odizing an aluminum or alumi- num alloy substrate, said sealing solution consisting of a dilute so-

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162 Metal Finishing