Developing an In-Situ Inspection Technique for Superconducting Wire

Phase 1: Design of a Stud Pull Testing Device

By Cory SpicerAdvised by Professor Bucinell

Modern Power Transmission:Trouble Ahead

Aging equipment and increasing populations are stretching power grids to their limits.

More disasters like the 2003 blackout will occur unless something is changed.

http://www.beggingtodiffer.com/archives/blackout%202003.jpg

A Possible Solution:Superconductivity

Provides no resistance to electrical flow. Allows for transmission of power with virtually

no loss and much less cable material.

Ekin, Jack, et al. “Electromechanical Studies for Coated-conductor Development” NIST, August 2005.

Substrate~ 80nm alumina

Superconductor Stabilizer

~ 10nm IBAD MgO

~ 30nm STO~ 30nm Homo-epi MgO

~ 7nm yttria

Substrate~ 80nm alumina

Superconductor Stabilizer

~ 10nm IBAD MgO

~ 30nm STO~ 30nm Homo-epi MgO

~ 7nm yttria

Background:Summer Internship at Superpower, Inc

Mainly tested critical current of HTS samples.

Also tested thickness, mechanical properties.

Senior Project:Testing Lamination Strength

Performance of HTS device depends highly on quality of adhesion between layers on tape.

A method of testing the strength of the lamination is needed.

The aim of this project is to work with Superpower and NIST to develop a testing apparatus.

Stud Pull Testing Device

This instrument is fixed to the top of the tape, and the strength required to delaminate the layers is considered.

Ekin, Jack, et al. “Electromechanical Studies for Coated-conductor Development” NIST, August 2005.

Stud Pull Testing Device

Lamination failure

Ekin, Jack, et al. “Electromechanical Studies for Coated-conductor Development” NIST, August 2005.

Preliminary Data

Early testing gives an estimate for internal strength.

Much more testing needs to be performed to yield statistically accurate results.

Ekin, Jack, et al. “Electromechanical Studies for Coated-conductor Development” NIST, August 2005.

8 samples

Stud Pull Tester:Important Features

Device is bi-axially gimbaled, so force is directed straight up.

Capable of testing internal strength and slit edge strength.

Ekin, Jack, et al. “Electromechanical Studies for Coated-conductor Development” NIST, August 2005.

Stud Pull Tester:Current Problems

Samples must be cooled in a stress-free manner, which is difficult.

Epoxy is needed to attach tape to stud puller, which creates a thermal stress boundary layer.

There is no previous data to compare and/or verify results.

This Term’s Activities

Met with associates from Superpower to select appropriate goals for this phase of the project.

Established communications with Jack Ekin at NIST.

Familiarized myself with the current status and use of the stud pull tester prototype.

Researched some epoxies, such as PEEK.

Planned Activities

Work with Superpower, Inc. and NIST to improve functionality of device.

Select an appropriate epoxy for cryogenic testing.

Possibly investigate numerical modeling of delamination testing.

Acknowledgements

Dr. Ronald Bucinell, Union College Dr. Jody Reeves, IGC-Superpower, Inc Dr. Jack Ekin, NIST

Questions?