Design and Development of Micro Energetic Initiators … & Armaments COMmand Design and Development...

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TTank-automotive & AArmaments COMCOMmand

Design and Development of Micro EnergeticInitiators (MEI)

NDIA Fuze Conference04/09/2003

Author: Neha MehtaTACOM-ARDECChemical Engineer

Co-Authors:Brian Fuchs, Gartung Cheng, Mark Gelak –TACOM-ARDECDaniel Stec III – Geo CentersAmish Desai- Tanner Research

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THE TEAM

Ε TACOM-ARDEC Ε Geo–Centers, Inc.w Brian Fuchs w Daniel Stec III

w Gartung Cheng Ε Tanner Research Assoc.w Neha Mehta w Amish Desaiw Gerard Gillenw Mark Mezgerw Mark Gelakw Charles Robinsonw Mantech & JSSAP Funding

INTRODUCTION• A joint ARMY/Industry program to develop a

process for manufacturing MEI for MEMS S&Adevices

• Current issues with traditional S&A that can beresolved with MEMS S&As– Cost– Weight– Size

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OBJECTIVE

• Program Overall Objective: Develop low costSafe and Arm System for the XM-29 IntegratedAirburst Weapon System

• Our Objective:– Develop low energy compact bridge design– Use bridge design in developing an MEI

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Schematic

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MEI ISSUES

• Cost– Loadability– Producibility

Ø While maintaining Reliability

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MEI Development

• 4 generations of ARDEC/Tanner Bridges– Flat geometry– Thin film heating element– Semiconductor Industry Procedures

• COTS Vishay Bridges• Loaded with Lead Styphnate• Obtained Firing voltage with XM29 firing

circuit

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Videography Test Setup

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Header with leads

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Functioning of 1st generationARDEC/Tanner Fixture

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ARDEC/Tanner 1st generation Bridges

62.8

9V Battery54.6

102.8

104.7

Firing Voltage(V)

MeasuredResistance (Ω)

Unit

L = 2 6 0 0W = 5 0 R = 3Ω

L = 2 6 0 0W = 5 0 R = 3Ω

L = 1 8 * 5 2 5W = 1 0 R = 6 0 Ω

L = 1 3 0 0W = 2 5 R = 3 Ω

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ARDEC/Tanner 2nd Generation

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2nd Generation Headers Firedwith Lead Styphnate

43.6

2.52.4

43.6

31.6

Firing Voltage(V)

MeasuredResistance (Ω)

Unit

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3rd generation of ARDEC/Tanner Bridgesloaded with Lead Styphnate

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3.01.9

2.751.5

2.51.8

3.01.3

Voltage (V)Measured

Resistance (Ω)Unit

4th generation of ARDEC/TannerBridges

• Photoresist InsulatedBridges

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4th Generation Headers withpolyimide substrate

Unit

1.5

1.8

2.3

1.1

MeasuredResistance (Ω)

û = 1.45s = 0.213

û = 1.23s = 0.051

û = 1.54s = 0.056

û = 1.43s = 0.068

Bruceton test Results

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Vishay & ARDEC/Tanner Headers

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Vishay Bridges

4.02.57-L 2R

2.52.54-H 2R

3.05.73-H 5R

û = 1.407s = 0.0831

1.52.62-L 2R

1.55.21-H 5R

1.53.71-H 2R

Bruceton testResult

Firing Voltage(V)

MeasuredResistance (O)Unit

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Conclusion

• Met voltage requirements with highreliability

• Developed MEI• System has applicability to munitions

system

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