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2212-8271 © 2014 Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/3.0/).Peer-review under responsibility of the International Scientifi c Committee of the “International Conference on Manufacture of Lightweight Components – ManuLight 2014”doi: 10.1016/j.procir.2014.06.114

Procedia CIRP 18 ( 2014 ) 96 – 101

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© 2014 Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/3.0/).Peer-review under responsibility of the International Scientifi c Committee of the “International Conference on Manufacture of Lightweight Components – ManuLight 2014”

97 H.M.A. Hussein / Procedia CIRP 18 ( 2014 ) 96 – 101

98 H.M.A. Hussein / Procedia CIRP 18 ( 2014 ) 96 – 101

99 H.M.A. Hussein / Procedia CIRP 18 ( 2014 ) 96 – 101

3.1. Die-Set module

100 H.M.A. Hussein / Procedia CIRP 18 ( 2014 ) 96 – 101

D01 D02

101 H.M.A. Hussein / Procedia CIRP 18 ( 2014 ) 96 – 101