Package weight

Package dimensions

960

Upper3/Down2

960mm

Intelligent level sirocco and

rapid infrared heating

1

300mm

Left→Right

Net transmission＋

chain transmission

0-1500 mm/min

Three phase 5 line 380V 50/60Hz

4.5KW

15 mins

Room Temperature ～300℃

PID closed-loop control

±1℃

±2℃

1460x630x470

90KGs130KGs

1500x900x650

ChipMax GroupThe Technology Cluster SOLDERING REFLOW OVEN

Standalone model of Reflow Oven with Intelligent level sirocco and rapid infrared heating

960

Model

The heating zone quantity

The length of the heating zone

The heating type

The cooling zone quantity

Maximum width of PCB board

The operation direction

Delivery options

The speed of conveyer belt

The power supply

Peak power

Initial Heat up time

Temperature control range

Temperature control mode

Temperature control accuracy

PCB temperature distribution deviation

Overall dimensions

Machine weight

Technical Specifications

Infrared emission and circulation of the hot airflow

8 Intelligent waves heating temperature

Enhanced Infrared Soldering Area

Choice for different soldering cycles

Mutli-Functions

Ø

Ø

Ø

Ø

Ø

Ø

Special heat up and temperature equalization with all designs

Features

Table-top Model Reflow Oven with Infrared heater and hot air flow method.

Technical Specifications

962A/962C

Model 962C 962A

1~8 min

0-280℃

AC220V/50~60Hz

1500W

300x320mm

430x370x260mm

500x430x330mm

14Kg

1~8 min

0-280℃

AC220V/50~60Hz

2500W

400x600mm

684x504x225mm

780x600x330mm

22Kg

Cycle Time:

Temperature Range:

Power Supply:

Rated Power:

Maximum soldering area:

Size:

Packing Size:

Gross Weight:

962C

962A

For more details www.chipmax.in

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LE

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T Sitech Electronics,#45, 2nd Main Road, Manorayana Palya, R T Nagar, Bangalore 560032.Mobile : +91 9243777818, + +91 80 23656465Email : Info@chipmax.in

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